(HP-65) The destructive bond pull test

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Extracts from the ABSTRACT and the Introduction of The Destructive Bond Test, US Commerce Dept., NBS Pub. 400-18, FEB 1976.

ABSTRACT
This report summarizes the work done at NBS on the destructive bond pull test as applied to small-diameter (approximately 1 mil or 25 μm) ultrasonically bonded aluminum wire … report begins with a,brief summary of the calculation of the resolution-of-forces operative in the bond system during the application of the pulling force …
INTRODUCTION
This report is an edited summary of the NBS effort on the destructive bond pull test.
The rationale for this work lies in the widespread use of this test method in the electro nics industry to evaluate the mechanical strength of wire bonds in semiconductor devices and in the large gap between the use of the pull test and the acquisition of reproducible calculable quantities which could be used to quantify the test results … to carry out this program, It was necessary to correlate the
measured pull strength as determined in the pull test with the stress in the wire, which depends on the geometry of the bond system. This was done through the resolution-of-forces calculation. An extensive series of experiments was undertaken in order to relate observed pull strengths to the results of the resolution-of-forces calculation … calculation of the resolution of the forces operative in the bond system during the application of the pulling force. A more complete derivation is presented in Appendix A and programs (in several different languages) which may be used for numerical calculation of the resolution-of-forces equations are given in Appendix B …
B1 . HP-65 Program for Resolution-of-Forces Calculation … 34 …

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